Title |
Flip-Chip-Technologie auf keramische Substrate / Markus Noren. Gutachter: Heiko Thust ; Gregor Feiertag. Betreuer: Jens Müller |
---|---|
Involved |
Markus Norén (Verfasser) |
Published |
Ilmenau: Universitätsbibliothek Ilmenau |
Extent |
Online-Ressource |
Thesis |
Ilmenau, Univ., Diss., 2009 |
Language |
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Country |
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Topic |
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Subject |
LTCC, Flip-Chip-Technologie, Verbindungstechnik, System-in-Package, Thermodynamische Eigenschaft, Miniaturisierung, Mobiles Endgerät, Thermische Belastung, Mechanische Beanspruchung |
DDC notation |
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Persistent identifier |
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Record ID |
1010814621 |
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