Title |
Bending-stress management by stacking of ultrathin integrated circuit chips / Stefan Endler |
|---|---|
Involved |
Stefan Endler (Verfasser) |
Published |
Uelvesbüll: Der Andere Verl. |
Extent |
141 S. : graph. Darst. |
Thesis |
Zugl.: Stuttgart, Univ., Diss., 2012 |
ISBN |
978-3-86247-315-1 |
Language |
|
Country |
|
Topic |
Elektrotechnik, Elektronik |
Subject |
Integrierte Schaltung, Chip, Dünne Schicht, Stapel, Biegsamkeit, Spannungsanalyse, Stabilität, Piezowiderstandseffekt, Resistiver Sensor |
DDC notation |
|
Record ID |
1028010605 |
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