Title |
Electrical and Thermal Simulation of Interconnection Systems of Deep Sub-micrometer Integrated Circuits / Xia Xiao |
|---|---|
Involved |
Xia Xiao (Verfasser) |
Published |
Aachen: Shaker |
Extent |
Online-Ressource, 178 Seiten : 93 Abb. |
ISBN |
978-3-8322-0080-0 |
Language |
|
Country |
|
Subject |
ULSI, Nanometerbereich, Leiterbahn, Netzwerksimulation, Elektrische Eigenschaft, Thermodynamische Eigenschaft |
Series |
Berichte aus der Elektronik |
Other editions |
Erscheint auch als Druck-Ausgabe: Electrical and thermal simulation of interconnection systems of deep sub-micrometer integrated circuits |
Persistent identifier |
|
Further information |
Lizenzpflichtig |
Record ID |
1176352865 |
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