Katalog der Deutschen Nationalbibliothek

Go to:

Media

Available in Frankfurt
Available in Frankfurt
Available in Leipzig
Available in Leipzig

Ehrenfried Zschech, Werner Blum, Inka Zienert et al.

Effect of Copper Line Geometry and Process Parameters on Interconnect Microstructure and Degradation Processes

Published in: International journal of materials research : IJMR 92, 7, 2022

Title

Effect of Copper Line Geometry and Process Parameters on Interconnect Microstructure and Degradation Processes

Involved 

Ehrenfried Zschech (Verfasser)
Werner Blum (Verfasser)
Inka Zienert (Verfasser)
Paul R. Besser (Verfasser)

Published in

International journal of materials research : IJMR 92, 7, 2022, Seite 803-809

Published

11.02.2022

Language

Englisch

Country

Deutschland

Subject

Interconnect microstructure
Degradation processes
Microprocessors

Persistent identifier

urn:nbn:de:101:1-2503050319392.985374856019 (URN)
10.1515/ijmr-2001-0147 (DOI)

Record ID

1358639280
Please note

The beta version does not yet contain all functions and information of the DNB portal catalogue. If you are missing information or want to order a medium, please visit the page in the DNB portal catalogue via the following link:

DNB portal