Title |
High temperature pressure sensor assembly and packaging for application up to 500 °C |
|---|---|
Involved |
Nilavazhagan Subbiah (Verfasser)
Jürgen Wilde (Akademischer Betreuer) Jürgen Wöllenstein Edoardo Milana
Albert-Ludwigs-Universität Freiburg. Fakultät für Angewandte Wissenschaften (Grad-verleihende Institution)
Albert-Ludwigs-Universität Freiburg. Institut für Mikrosystemtechnik (Mitwirkender) |
Published |
Freiburg: Universität |
Extent |
Online-Ressource |
Thesis |
Dissertation, Universität Freiburg, 2026 |
Language |
|
Country |
|
Topic |
|
Subject |
Flip-Chip-Technologie |
DDC notation |
|
Persistent identifier |
urn:nbn:de:bsz:25-freidok-2762025 (URN) |
Record ID |
1387948636 |
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