Title |
Thermo-mechanical reliability of flip-chip assemblies with heat spreaders / Bernhard Wunderle |
|---|---|
Involved |
Bernhard Wunderle (Verfasser) |
Published |
2003 |
Thesis |
Berlin, Techn. Univ., Diss., 2003 |
Language |
|
Subject |
Flip-Chip-Technologie, Lötverbindung, Temperaturwechselbeständigkeit, Mechanische Beanspruchung, Lebensdauer, Finite-Elemente-Methode |
Persistent identifier |
|
Record ID |
968327206 |
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