Title |
Force sensors for microelectronic packaging applications / J. Schwizer ; M. Mayer ; O. Brand |
|---|---|
Involved |
Jürg Schwizer (Verfasser) |
Published |
Berlin, Heidelberg, New York: Springer |
Extent |
VIII, 178 S. : Ill., graph. Darst. |
ISBN |
978-3-540-22187-6 |
Language |
|
Country |
|
Topic |
|
Subject |
Prozessüberwachung, Kraftsensor, Drahtbonden, Flip-Chip-Technologie |
Series |
Microtechnology and mems |
Other editions |
Erscheint auch als Online-Ausgabe: Force Sensors for Microelectronic Packaging Applications |
Further information |
Literaturverz. S. 165 - 174 |
Record ID |
971632855 |
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