Title |
Adhäsionsmechanismen im Packaging von mikroelektronischen Bauteilen / Anja Hennig |
|---|---|
Involved |
Anja Hennig (Verfasser) |
Published |
Tönning, Lübeck, Marburg: Der Andere Verl. |
Extent |
X, 173 S. : Ill., graph. Darst. |
Thesis |
Zugl.: Dresden, Techn. Univ, Diss., 2006 |
ISBN |
978-3-89959-457-7 |
Country |
|
Topic |
|
Subject |
Chip, Halbleitergehäuse, Adhäsion, Delamination, Polyimide |
Record ID |
979386152 |
Please note
The beta version does not yet contain all functions and information of the DNB portal catalogue. If you are missing information or want to order a medium, please visit the page in the DNB portal catalogue via the following link: